Die MagicRay 3D SPI-VSP3000-Serie eignet sich für die 3D-Lötpasteinspektion nach dem SMT-Druck

SMT-Pick-and-Place-Maschinen
June 04, 2025
Kategorieverbindung: SMT-Platzierungsmaschine
Kurzfassung: Discover the MagicRay 3D SPI-VSP3000 Series, the ultimate solution for 3D solder paste inspection after SMT screen printing. This advanced system ensures precision and quality in PCB manufacturing with cutting-edge technology.
Verwandte Produktmerkmale:
  • Intelligent zero reference point technology ensures accurate height measurement.
  • Detects solder bridging, solder breakage, and icicles effectively.
  • Works efficiently with PCBs of different color variations.
  • Automatic solder pad compensation enhances height and volume measurement accuracy.
  • SPC data analysis aids in improving process quality.
  • Three Point Checks software quickly identifies root causes of solder paste issues.
Fragen und Antworten:
  • What is the primary function of the MagicRay 3D SPI-VSP3000 Series?
    The MagicRay 3D SPI-VSP3000 Series is designed for 3D solder paste inspection after SMT screen printing, ensuring precision and quality in PCB manufacturing.
  • How does the system ensure accurate measurements?
    It uses intelligent zero reference point technology and automatic solder pad compensation to enhance the accuracy of height and volume measurements.
  • Can the MagicRay 3D SPI-VSP3000 Series detect PCB color variations?
    Yes, the system is effective in detecting PCBs with different color variations, ensuring reliable inspection results.